Feedback for power management of a memory die using capacitive coupling

ABSTRACT

A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.

CROSS REFERENCE

The present application for patent is a divisional of U.S. patentapplication Ser. No. 16/798,893 by Choi et al., entitled “FEEDBACK FORPOWER MANAGEMENT OF A MEMORY DIE USING CAPACITIVE COUPLING,” filed Feb.24, 2020, assigned to the assignee hereof, and is expressly incorporatedby reference in its entirety herein.

BACKGROUND

The following relates generally to one or more memory systems and morespecifically to feedback for power management of a memory die usingcapacitive coupling.

Memory devices are widely used to store information in variouselectronic devices such as computers, wireless communication devices,cameras, digital displays, and the like. Information is stored byprograming memory cells within a memory device to various states. Forexample, binary memory cells may be programmed to one of two supportedstates, often denoted by a logic 1 or a logic 0. In some examples, asingle memory cell may support more than two states, any one of whichmay be stored. To access the stored information, a component may read,or sense, at least one stored state in the memory device. To storeinformation, a component may write, or program, the state in the memorydevice.

Various types of memory devices and memory cells exist, includingmagnetic hard disks, random access memory (RAM), read-only memory (ROM),dynamic RAM (DRAM), synchronous dynamic RAM (SDRAM), ferroelectric RAM(FeRAM), magnetic RAM (MRAM), resistive RAM (RRAM), flash memory, phasechange memory (PCM), self-selecting memory, chalcogenide memorytechnologies, and others. Memory cells may be volatile or non-volatile.Non-volatile memory, e.g., FeRAM, may maintain their stored logic statefor extended periods of time even in the absence of an external powersource. Volatile memory devices, e.g., DRAM, may lose their stored statewhen disconnected from an external power source.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a system that supports feedback forpower management of a memory die using capacitive coupling in accordancewith examples as disclosed herein.

FIG. 2 shows an example of a system that supports feedback for powermanagement of a memory die using capacitive coupling in accordance withexamples as disclosed herein.

FIG. 3 shows an example of a system that supports feedback for powermanagement of a memory die using capacitive coupling in accordance withexamples as disclosed herein.

FIG. 4 shows an example of a system that supports feedback for powermanagement of a memory die using capacitive coupling in accordance withexamples as disclosed herein.

FIG. 5 shows a block diagram of a memory device that supports feedbackfor power management of a memory die using capacitive coupling inaccordance with examples as disclosed herein.

FIGS. 6 and 7 show flowcharts illustrating a method or methods thatsupport feedback for power management of a memory die using capacitivecoupling in accordance with examples as disclosed herein.

DETAILED DESCRIPTION

In some memory systems, a power management component, such as a powermanagement integrated circuit (PMIC), may be used to manage the powersupplied to one or more memory devices by controlling the voltage of apower supply rail. In some cases, the voltage on a power supply rail maybe attenuated at locations farther away from the power managementcomponent due to, for example, parasitic capacitance along the rail orother factors. For memory devices that are relatively far away from thepower management component, the voltage on the power supply rail may besufficiently attenuated to drop below a minimum supply voltage, whichmay cause errors at the memory device. A power management component maynot have access to information about the voltage at various locationsalong the rail, however, and may not be able to adjust the powersupplied to the rail to compensate for such deviations from a targetrange of the voltage level.

A memory device may include one or more pins that may be used toconfigure various operating configuration settings of the memory device,such as a command addressing mode, a test mode, or other configurationsettings, by setting (e.g., providing, maintaining) a direct current(DC) voltage (e.g., a constant voltage) at the pin. In some examples,the pin may be coupled with a voltage supply that is set to a particularDC voltage to configure the operating configuration setting of thememory device. In some examples, the memory device may determine (e.g.,identify, detect) the DC voltage at the pin during a start-up orinitialization procedure and may subsequently operate (e.g., performmemory access operations such as read or write operations, or performother operations) based on the configuration setting associated withthis voltage. In some examples, the memory device may not continuouslymonitor the voltage at the pin once the configuration setting has beendetermined, or may occasionally check the voltage at the pin after thestart-up or initialization procedure. Thus, such a configuration pin maybe available for use by the memory device for other purposes (such asfor transmitting signals) some or all of the time after the voltage hasbeen detected by the memory device. Because the pin may be coupled witha voltage source that maintains a DC voltage at the pin, however, it maybe challenging to use the pin for transmission of other signals.

A memory device may use (e.g., re-use) such a pin for providing feedbackto the power management component about the voltage level of a powersupply rail at the memory device. The memory device may provide suchfeedback by generating an alternating current (AC) signal at the pinthat may be transmitted to the power management component using acapacitive coupling approach that blocks the DC voltage at the pin andpasses the AC signal. For example, if the memory device determines thatthe supply voltage is outside of a target range associated with thesupply voltage, the memory device may generate an AC feedback signal(such as by generating one or more voltage pulses or other non-constantvoltage signals) at a configuration pin of the memory device to indicatethat the supply voltage is outside of a target range. The target rangemay be, for example, a voltage range for a supply voltage at which thememory device is designed to operate properly, such as a supply voltagerange specified by a specification document associated with the memorydevice.

The AC signal generated at the pin may be provided to the powermanagement component using capacitive coupling in which a capacitivecomponent located within a feedback signal path between the memorydevice and the power management component passes the AC feedback signalwhile blocking the DC voltage signal. For example, a pin of a memorydevice may be coupled with a power management component by way of anin-line capacitor between the memory device and the power managementcomponent. The in-line capacitor may enable capacitive coupling (e.g.,transmission) of an AC signal generated at the pin while blocking (e.g.,filtering out) the DC voltage signal generated by the voltage source. Inother examples, a pin of the memory device may be coupled with aconductive wire that is in close proximity to another conductive wirethat is coupled with the power management component, and the AC signalmay be capacitively coupled across the conductive wires by way ofparasitic capacitance in the circuitry.

The power management component, in turn, may be operable to detect thecapacitively coupled AC signal provided by the memory device. The powermanagement component may use such feedback information to determinewhether and how to adjust the power (e.g., a supply voltage) that issupplied to the memory device(s) via the power supply rail.

In some cases, a memory system may include multiple memory devices, eachof which may include a configuration pin coupled with the powermanagement component by way of an in-line capacitor (or by way ofparasitic capacitance, or both). Each of the memory devices may providefeedback to the power management component as described above, bygenerating an AC signal at a respective pin of each memory device. Incases where the power management component is coupled with multiplememory devices that each provide feedback by generating an AC signal,the power management component may be operable to detect such feedbackseparately for each memory device, or to detect combined feedback fromall of the memory devices. The power management component may thenadjust the voltage of the rail based on the feedback received from oneor more memory devices.

The use of capacitive coupling for transmission of an AC feedback signalfrom the memory device to the power management component as describedherein may enable a memory device to provide such feedback usingexisting pins rather than by adding new pins, thereby reducing the costand area associated with providing such feedback and potentiallyenabling backward compatibility with existing designs.

Features of the disclosure are further described below in the context ofmemory systems and dies with reference to FIG. 1. Features of thedisclosure are then described in the context of memory systems withreference to FIGS. 2-4. These and other features of the disclosure arefurther illustrated by and described with reference to an apparatusdiagram and flowcharts in FIGS. 5-7 that relate to feedback for powermanagement of a memory die using capacitive coupling.

FIG. 1 illustrates an example of a system 100 that utilizes one or morememory devices in accordance with examples as disclosed herein. Thesystem 100 may include a host device 105, a memory device 110, and aplurality of channels 115 coupling the host device 105 with the memorydevice 110. The system 100 may include one or more memory devices 110,but aspects of the one or more memory devices 110 may be described inthe context of a single memory device (e.g., memory device 110).

The system 100 may include portions of an electronic device, such as acomputing device, a mobile computing device, a wireless device, agraphics processing device, a vehicle, or other systems. For example,the system 100 may illustrate aspects of a computer, a laptop computer,a tablet computer, a smartphone, a cellular phone, a wearable device, aninternet-connected device, a vehicle controller, or the like. The memorydevice 110 may be a component of the system operable to store data forone or more other components of the system 100.

At least portions of the system 100 may be examples of the host device105. The host device 105 may be an example of a processor or othercircuitry within a device that uses memory to execute processes, such aswithin a computing device, a mobile computing device, a wireless device,a graphics processing device, a computer, a laptop computer, a tabletcomputer, a smartphone, a cellular phone, a wearable device, aninternet-connected device, or some other stationary or portableelectronic device, among other examples. In some examples, the hostdevice 105 may refer to the hardware, firmware, software, or acombination thereof that implements the functions of an external memorycontroller 120. In some examples, the external memory controller 120 maybe referred to as a host or a host device 105.

A memory device 110 may be an independent device or a component that isoperable to provide physical memory addresses/space that may be used orreferenced by the system 100. In some examples, a memory device 110 maybe configurable to work with one or more different types of hostdevices. Signaling between the host device 105 and the memory device 110may be operable to support one or more of: modulation schemes tomodulate the signals, various pin configurations for communicating thesignals, various form factors for physical packaging of the host device105 and the memory device 110, clock signaling and synchronizationbetween the host device 105 and the memory device 110, timingconventions, or other factors.

The memory device 110 may be operable to store data for the componentsof the host device 105. In some examples, the memory device 110 may actas a slave-type device to the host device 105 (e.g., responding to andexecuting commands provided by the host device 105 through the externalmemory controller 120). Such commands may include one or more of a writecommand for a write operation, a read command for a read operation, arefresh command for a refresh operation, or other commands.

The host device 105 may include one or more of an external memorycontroller 120, a processor 125, a basic input/output system (BIOS)component 130, or other components such as one or more peripheralcomponents or one or more input/output controllers. The components ofhost device may be in coupled with one another using a bus 135.

The processor 125 may be operable to provide control or otherfunctionality for at least portions of the system 100 or at leastportions of the host device 105. The processor 125 may be ageneral-purpose processor, a digital signal processor (DSP), anapplication-specific integrated circuit (ASIC), a field-programmablegate array (FPGA) or other programmable logic device, discrete gate ortransistor logic, discrete hardware components, or a combination ofthese components. In such examples, the processor 125 may be an exampleof a central processing unit (CPU), a graphics processing unit (GPU), ageneral purpose GPU (GPGPU), or a system on a chip (SoC), among otherexamples. In some examples, the external memory controller 120 may beimplemented by or be a part of the processor 125.

The BIOS component 130 may be a software component that includes a BIOSoperated as firmware, which may initialize and run various hardwarecomponents of the system 100 or the host device 105. The BIOS component130 may also manage data flow between the processor 125 and the variouscomponents of the system 100 or the host device 105. The BIOS component130 may include a program or software stored in one or more of read-onlymemory (ROM), flash memory, or other non-volatile memory.

The memory device 110 may include a device memory controller 155 and oneor more memory dies 160 (e.g., memory chips) to support a desiredcapacity or a specified capacity for data storage. Each memory die 160may include a local memory controller 165 (e.g., local memory controller165-a, local memory controller 165-b, local memory controller 165-N) anda memory array 170 (e.g., memory array 170-a, memory array 170-b, memoryarray 170-N). A memory array 170 may be a collection (e.g., one or moregrids, one or more banks, one or more tiles, one or more sections) ofmemory cells, with each memory cell being operable to store at least onebit of data. A memory device 110 including two or more memory dies maybe referred to as a multi-die memory or a multi-die package or amulti-chip memory or a multi-chip package.

In some examples, a memory die 160 may be coupled with a powermanagement component that is operable to provide one or more supplyvoltages to the memory die 160. For example, the power managementcomponent may supply a VDD voltage, a VSS voltage, a VDDQ voltage, etc.using power supply rails (e.g., conductive lines). The power managementcomponent may be operable to maintain a substantially constant supplyvoltage on the rail to provide power to the memory device 110 or memorydie 160 during operation. The power management component may include ormay be coupled with one or more voltage supply components that areoperable to generate the appropriate supply voltage. In some cases, thepower management component may be referred to as a PMIC or a registeredclock device (RCD).

In some cases, the voltage along a power supply rail may decrease alongthe rail as the distance from the power management component increasesdue to, for example, parasitic capacitance along the rail. Thus, ifmultiple memory dies 160 are coupled with a power supply rail thatprovides a supply voltage to the memory dies 160, a memory die 160 thatis relatively far away from the power management component may receive alower supply voltage than a memory die 160 that is closer to the powermanagement component. In some cases, if the supply voltage dips below alower voltage threshold, the memory die 160 may experience memoryerrors.

In some examples, a memory die 160 (or memory device 110) may include aconfiguration pin that may be used for communicating (e.g., receiving) aDC voltage that indicates an operating configuration setting of thememory die. The configuration pin may be coupled with a voltage sourcethat sets the voltage at the pin to a DC voltage indicating a particularoperating configuration setting of memory die 160, such as anoperational mode that may be specified to the memory die 160 uponstartup or initialization. In some cases, such a DC voltage may not becontrolled (e.g., may be uncontrolled) by a controller, such as acontroller of memory die 160 or another controller. That is, the DCvoltage may be maintained at a relatively constant value by a voltagesource rather than being controlled and possibly changed by acontroller.

In some examples, a memory die 160 may use (e.g., re-use) this pin forproviding feedback to the power management component regarding thesupply voltage on the power supply rail at the memory die, therebyenabling the power management component to adjust the supply voltageappropriately.

The device memory controller 155 may include circuits, logic, orcomponents operable to control operation of the memory device 110. Thedevice memory controller 155 may include the hardware, the firmware, orthe instructions that enable the memory device 110 to perform variousoperations and may be operable to receive, transmit, or executecommands, data, or control information related to the components of thememory device 110. The device memory controller 155 may be operable tocommunicate with one or more of the external memory controllers 120, theone or more memory dies 160, or the processor 125. In some examples, thedevice memory controller 155 may control operation of the memory device110 described herein in conjunction with the local memory controller 165of the memory die 160.

A local memory controller 165 (e.g., local to a memory die 160) may beoperable to control operation of the memory die 160. In some examples, alocal memory controller 165 may be operable to communicate (e.g.,receive or transmit data or commands or both) with the device memorycontroller 155. In some examples, a memory device 110 may not include adevice memory controller 155, and a local memory controller 165, or theexternal memory controller 120 may perform various functions describedherein. As such, a local memory controller 165 may be operable tocommunicate with the device memory controller 155, with other localmemory controllers 165, or directly with the external memory controller120, or the processor 125, or a combination thereof. Examples ofcomponents that may be included in the device memory controller 155 orthe local memory controllers 165 or both may include receivers forreceiving signals (e.g., from the external memory controller 120),transmitters for transmitting signals (e.g., to the external memorycontroller 120), decoders for decoding or demodulating received signals,encoders for encoding or modulating signals to be transmitted, orvarious other circuits or controllers operable for supporting describedoperations of the device memory controller 155 or local memorycontroller 165 or both.

A local memory controller 165 of a memory die 160 may be operable todetermine whether a supply voltage is outside a target range associatedwith the supply voltage. If the local memory controller 165 determinesthat the supply voltage is outside the target range, the local memorycontroller 165 may generate an AC signal at a pin of the memory die 160indicating that the supply voltage is outside of the range. For example,the local memory controller 165 may cause a driver to generate (e.g.,drive) an AC signal onto a pin of memory die 160, such as by driving oneor more voltage pulses onto the pin.

The external memory controller 120 may be operable to enablecommunication of one or more of information, data, or commands betweencomponents of the system 100 or the host device 105 (e.g., the processor125) and the memory device 110. The external memory controller 120 mayconvert or translate communications exchanged between the components ofthe host device 105 and the memory device 110. In some examples, theexternal memory controller 120 or other component of the system 100 orthe host device 105, or its functions described herein, may beimplemented by the processor 125. For example, the external memorycontroller 120 may be hardware, firmware, or software, or somecombination thereof implemented by the processor 125 or other componentof the system 100 or the host device 105. Although the external memorycontroller 120 is depicted as being external to the memory device 110,in some examples, the external memory controller 120, or its functionsdescribed herein, may be implemented by one or more components of amemory device 110 (e.g., a device memory controller 155, a local memorycontroller 165) or vice versa.

The components of the host device 105 may exchange information with thememory device 110 using one or more channels 115. The channels 115 maybe operable to support communications between the external memorycontroller 120 and the memory device 110. Each channel 115 may beexamples of transmission mediums that carry information between the hostdevice 105 and the memory device. Each channel 115 may include one ormore signal paths or transmission mediums (e.g., conductors) betweenterminals associated with the components of system 100. A signal pathmay be an example of a conductive path operable to carry a signal. Forexample, a channel 115 may include a first terminal including one ormore pins or pads at the host device 105 and one or more pins or pads atthe memory device 110. A pin may be an example of a conductive input oroutput point of a device of the system 100, and a pin may be operable toact as part of a channel.

Channels 115 (and associated signal paths and terminals) may bededicated to communicating one or more types of information. Forexample, the channels 115 may include one or more command and address(CA) channels 186, one or more clock signal (CK) channels 188, one ormore data (DQ) channels 190, one or more other channels 192, or acombination thereof. In some examples, may be communicated over thechannels 115 using single data rate (SDR) signaling or double data rate(DDR) signaling. In SDR signaling, one modulation symbol (e.g., signallevel) of a signal may be registered for each clock cycle (e.g., on arising or falling edge of a clock signal). In DDR signaling, twomodulation symbols (e.g., signal levels) of a signal may be registeredfor each clock cycle (e.g., on both a rising edge and a falling edge ofa clock signal).

FIG. 2 illustrates an example of a system 200 that supports feedback forpower management of a memory die using capacitive coupling. The system200 may include a power management component 205, a memory device 210that includes a memory array 215, and a feedback path 230 and supplypath 225 between the power management component 205 and the memorydevice 210. In the example of system 200, the feedback path 230 and/orsupply path 225 may include conductive lines that couple the powermanagement component 205 with the memory device 210. The memory device210 may be an example of a memory device 110 as described with referenceto FIG. 1. Memory array 215 may be an example of memory array 170 asdescribed with reference to FIG. 1.

The power management component 205 may include a supply interface 235,low-dropout regulators (LDO) 240, 245, power supplies (SWA, SWB) 250,255 (e.g., switching regulators), and multi-time programmable memory(MTP) 260. The supply interface 235 may be operable to receive power toactivate the power management component 205 and to be distributed toother components of a memory system (e.g., memory device 210) throughthe power management component 205.

The low-dropout regulators 240, 245 may be used for outputting power(e.g., DC power) to memory devices of the memory system, includingmemory device 210. In some cases, the low-dropout regulators 240, 245may be used to regulate an output voltage, such as a supply voltage. Thepower supplies 250, 255 may be used for outputting power to memorydevices of the memory system, including memory device 210. The powermanagement component 205 may include any quantity of low-dropoutregulators (e.g., one, two, three, four, five, six, seven, eight), ormay include any quantity of power supplies (e.g., one, two, three, four,five, six, seven, eight), or any quantity of both.

The multi-time programmable memory 260 may be any type of memory used bythe power management component 205 for performing the functionsdescribed herein. In some cases, the multi-time programmable memory 260may be an example of an electrically erasable programmable read-onlymemory (EEPROM) or other type of memory technology. The multi-timeprogrammable memory 260 may be for protecting circuits, improving areliability of a power-on sequence or a power-off sequence, setting ofoutput voltage(s), setting of output pull-down resistance(s), or otherfunctions, or any combination thereof.

The memory device 210 may include a pin 220 that may be used toconfigure an operational aspect of the memory device 210, and may bere-used for providing feedback to the power management component 205. Apin 220 may be, for example, a conductive terminal of an integratedcircuit package that allows the integrated circuit to be connected withother components or circuitry. A pin 220 may also be referred to as apad, a socket, a connector, a contact, or a ball (for a ball gridarray), for example. In some cases, a pin 220 may be a conductive pointthat is within an integrated circuit package or external to theintegrated circuit package.

The feedback path 230 may be a signal path that enables communication(e.g., transmission) of an AC signal from the pin 220 of the memorydevice 210 to the power management component 205 by way of a capacitivecomponent 265 positioned along the feedback path 230 between the pin 220and the power management component 205. Capacitive component 265 may be,for example, one or more discrete capacitors coupled between a firstconductive portion 230-a (e.g., a conductive line) of feedback path 230and a second conductive portion 230-b (e.g., a conductive line) offeedback path 230. In some examples, capacitive component 265 mayrepresent parasitic capacitance between first conductive portion 230-aand second conductive portion 230-b. The feedback path 230 may includeany set of one or more conductive lines that establish a communicativelink between the memory device 210 and the power management component205.

The supply path 225 may be a power supply rail (or may be coupled with apower supply rail) to enable the power management component 205 toprovide a supply voltage to memory device 210, for example. A supplyvoltage may be used by memory device 210 during operation of memorydevice 210, and may include, for example, a VDD voltage, a VSS voltage,or another supply voltage. Although one supply path 225 is depicted inFIG. 2, a memory device may include multiple supply paths 225 betweenmemory device 210 and power management component 205 to enable powermanagement component 205 to provide multiple different supply voltagesto memory device 210.

Techniques are provided herein for using pin 220 to provide feedback tothe power management component 205 by generating an AC signal at pin 220based on determining that a supply voltage provided by power managementcomponent 205 is outside a target range. The AC signal generated at pin220 may be communicated (e.g., transmitted) to power managementcomponent 205 using capacitive coupling. The capacitively coupled ACsignal may be detected by the power management component 205 (and/or byanother device, such as a host device) and may be used by the powermanagement component 205 to regulate (e.g., maintain or adjust) avoltage supplied to memory device 210 (e.g., using supply path 225) orto regulate another operational aspect of memory device 210.

FIG. 3 illustrates an example of a system 300 in accordance withexamples as disclosed herein. The system 300 includes a host device 305and a memory system 310. The host device 305 and the memory system 310may be coupled or connected (e.g., electrically) with each other over achannel 315 (e.g., a common channel, a shared channel). The host device305 may refer to a device that uses the memory system 310 for datastorage, or otherwise coordinates the use of the memory system 310 fordata storage.

The memory system 310 may include one or more memory devices 110 (e.g.,memory devices 110-a, 110-b) that may be examples of a memory device 110described with reference to FIG. 1, such as a DRAM device. Each memorydevice 110 may include a pin 220 (e.g., pins 220-a, 220-b) forconfiguring an operational aspect of respective memory device 110, andfor providing feedback to a power management component 205-a. Powermanagement component 205-a may be an example of power managementcomponent 205 as described with reference to FIG. 2.

In some examples, a memory system 310 may refer to a set of componentsthat are physically distinct from a host device 305, such as a memorymodule or a memory assembly. For example, a memory system 310 may referto a single in-line memory module (SIMM), a dual-in-line memory module(DIMM), or another type of module or assembly. In some cases, a SIMM orDIMM may include a power management component 205-a (e.g., as depictedin memory system 310). In some cases, the power management component205-a may be external to the SIMM or DIMM.

In some cases, a memory system 310 may include a single DRAM integratedcircuit (e.g., a single memory device 110). A memory system 310 mayinclude a first quantity of pins (e.g., 72 pins or another quantity ofpins) that may be used, for example, to couple the memory system 310with a power management component, a host processor, or other electroniccomponents, or for configuring an operational aspect of a memory device110. Each pin of a memory system 310 may support 32-bit data transfers.

In some cases, a memory system 310 may include a series of DRAMintegrated circuits, such as a series of memory devices 110. A memorysystem 310 may include a second quantity of pins (e.g., 100, 144, 168,172, 184, 204, 214, 240, or another quantity of pins) that may be used,for example, to couple the memory system 310 with a power managementcomponent, a host processor, or other electronic components, or forconfiguring an operational aspect of a memory device 110. Each pin of amemory system 310 may support 64-bit data transfers. In some cases, theDRAMs in a memory system 310 are coupled with one or more power supplyrails, and DRAMs that are farther away from the voltage supply mayreceive a lower voltage on the power supply rail than DRAMs that arecloser to the voltage supply.

In some examples, a pin (e.g., a configuration pin) of a memory device110 may be coupled with a voltage source that biases (e.g., sets,drives) the voltage at the pin to a DC voltage that indicates anoperating configuration setting of memory device 110, such as aconfiguration of a command address mode or a configuration of a testmode. A memory device 110 may include one or more such configurationpins, each of which may be coupled to the same or different voltagesources, and may be biased to the same or different voltages.

In some examples, a memory device 110 may include one or more pins forreceiving a DC voltage that indicates an operating configuration of acommand address mode of the memory device. The memory device may performaccess operations such as read operations, write operations, or otheroperations on the memory array based on the operating configuration ofthe command address mode.

For example, a memory device 110 may include an MIR (mirror) pin thatmay be used to configure the memory device 110 for operation in either amirrored command addressing mode or a standard command addressing mode.If the MIR pin is biased to a first DC voltage (e.g., to VDDQ), forexample, the memory device 110 may internally swap even-numbered commandaddresses with the next higher odd-numbered command address. If the MIRpin is biased to a second DC voltage (e.g., to VSSQ), the memory device110 may not perform such internal swapping of command addresses.

For example, a memory device 110 may include a CAI (command and addressinversion) pin that may be used to configure the memory device 110 foroperation with the logic levels for command address signals eitherinverted or not inverted. If the CAI pin is biased to a first DC voltage(e.g., to VDDQ), for example, the memory device 110 may internallyinvert the logic level present on all of the command address signals. Ifthe CAI pin is biased to a second DC voltage (e.g., to VSSQ), the memorydevice 110 may not perform such internal inversion of the logic levelsfor the command address signals.

In some examples, a memory device 110 may include one or more pins forreceiving a DC voltage that indicates an operating configuration of atest mode of the memory device 110. The memory device 110 may perform atest operation on the array of memory cells or may operate normallybased on the operating configuration of the test mode. For example, amemory device 110 may include a TEN (connectivity test mode enable) pinto configure the memory device 110 with connectivity test mode operationenabled. If the TEN pin is biased to a first voltage (such as a HIGHvoltage, or another voltage signal), the connectivity test mode may beenabled, and if the TEN pin is biased to a second voltage. theconnectivity test mode may be disabled. When the connectivity test modeis enabled, some of the pins of memory device 110 may be used as testinputs and other pins may be used as test outputs. The memory device 110can be tested by providing test signals at the test input pins andmonitoring outputs at the test output pins. Such a test mode may beenabled for testing a memory device 110 before the memory device 110 isshipped to a customer, for example, and may be disabled during normaloperation. Thus, during normal operation of memory device 110, the TENpin may be biased to a DC voltage (e.g., VSS) indicating thatconnectivity test mode is disabled. In some examples, the TEN pin may bedirectly coupled with a VSS voltage source or ground, or may be beinginternally pulled low through a weak pull-down resistor to a VSSvoltage.

In some examples, a memory device 110 may include other pins that areunused some or all of the time during normal operation of memory device110. For example, a memory device 110 may include one or more LBDQ(loopback data output) pins that may operate as output pins foroutputting loopback information when a loopback setting of the memorydevice 110 indicates that a loopback mode is enabled, such as fortesting memory device 110 or for other purposes. Such LBDQ pin(s) may beset to an inactive state (e.g., terminated or set to a high impedancestate) when the loopback setting indicates that the loopback mode isdisabled, such as during normal operation of memory device 110. Thus,when memory device 110 is not operating in the loopback mode, the LBDQpin(s) may be available for transmitting feedback information to thepower management component.

A memory device 110 may include some or all of the above-describedconfiguration pins or pins that are unused some or all of the timeduring normal operation of memory device 110, and may include additionalsuch pins that are not described here but that may be used for providingfeedback to a power management component as described herein.

In some cases, memory device 110 may determine whether a supply voltageused during operation of memory device 110 is outside of a target range.If memory device 110 determines that the supply voltage is outside ofthe target range, memory device 110 may generate an AC signal at the pin220 to indicate that the supply voltage is outside the target range. Forexample, memory device 110 may drive one or more voltage pulses,sinusoids, or other type of AC signal onto pin 220 to indicate that thesupply voltage is outside the target range. In some examples, memorydevice 110 may generate a first AC signal if memory device determinesthat the supply voltage is below a lower voltage threshold of the targetrange, and may generate a second (e.g., different) AC signal based ondetermining that the supply voltage is above an upper voltage thresholdof the target range.

In some examples, memory device 110 may be operable to determine a value(e.g., a voltage value) of the supply voltage. Memory device 110 mayindicate the value of the supply voltage by driving a quantity ofvoltage pulses at the pin 220, where the quantity of voltage pulsesindicates the value of the supply voltage. For example, memory devicemay drive a first quantity of pulses onto the pin 220 based ondetermining a first value of the supply voltage, and may drive a secondquantity of pulses onto the pin 220 based on determining a second valueof the supply voltage.

Power management component 205-a may be operable to receive (e.g.,detect) an AC signal generated at the pin 220 and transmitted to powermanagement component 205-a using capacitive coupling (e.g., by way of acapacitive component 265 in feedback path 230). For example, powermanagement component 205-a may be operable to detect a quantity ofvoltage pulses generated at the pin 220, such as a quantity of voltagepulses initiated by the memory device 110 and transmitted to powermanagement component 205-a using capacitive coupling.

The power management component 205-a may, based on the received ACsignal, maintain or adjust the power supplied to the memory device 110.Power management component 205-a may for example, maintain, increase, ordecrease the voltage on the supply rail using LDO 240, 245, SA 250, 255,MTP 260, or a combination of these components. Memory device 110 may beoperable to receive an adjusted supply voltage (e.g., from powermanagement component 205-a) based on (e.g., after) generating an ACsignal at the pin 220.

The power management component 205-a may be coupled with multiple memorydevices 110-a, 110-b using a feedback path 230-c. Each memory device110-a, 110-b may be coupled with a respective capacitive component265-a, 265-b for capacitively coupling an AC signal at a respective pin220-a, 220-b of the memory device 110-a, 110-b. The capacitivecomponents 265-a, 265-b may be coupled between the pin 220-a, 220-b andthe power management component 205-a along respective branches offeedback path 230-c. Each memory device 110-a, 110-b may provide anindication of the supply voltage at the memory device 110 (e.g., bygenerating an AC signal at a respective pin 220-a, 220-b indicating thesupply voltage).

In some cases, each memory device 110 may apply a different drivestrength at pin 220 to weight the AC feedback signal of each memorydevice 110. In some cases, a drive strength may be an amount ofelectrical current that is sourced (e.g., supplied) or sunk (e.g.,received) at pin 220 while outputting or maintaining a given voltage atpin 220. For example, each memory device 110 may be pre-configured toapply a particular drive strength at pin 220 based on, for example, thelocation of the memory device 110 within the memory system 310 or theproximity (e.g., electrical proximity) of the memory device 110 to thepower supply.

In some cases, each memory device 110 may be coupled with powermanagement component 205-a using a separate point-to-point connection(e.g., a separate feedback path), and power management component 205-amay internally weight or otherwise process the feedback from each memorydevice 110 to determine how to adjust a supply voltage.

FIG. 4 depicts an example of a system 400 that support feedback forpower management of a memory die using capacitive coupling in accordancewith examples disclosed herein. The system 400 includes a memory device110-c coupled with a power management component 205-b by way of acapacitive component 265-c. Capacitive component 265-c may include adiscrete capacitor or may represent parasitic capacitance or both, forexample.

Memory device 110-c includes pin 220-c, which may be, for example, anMIR pin, CAI pin, TEN pin, or LBDQ pin as described with reference toFIG. 3, or may be another type of pin. Pin 220-c may be coupled with avoltage source 325-c that may bias a voltage at pin 220-c to specify anoperating configuration setting of memory device 110-c. In someexamples, voltage source 325-c may be a VDD voltage source, a VDDQvoltage source, a VSS voltage source, or a ground voltage (e.g., pin220-c may be tied to ground).

Memory device 110-c may include a driver 405 coupled with pin 220-c andoperable to drive (e.g., generate) an AC signal onto pin 220-c, such asby driving one or more voltage pulses or other non-constant voltagesignals onto pin 220-c. Although driver 405 is depicted as being part ofmemory device 110-c, in some cases, driver 405 may be external to memorydevice 110-c. Memory device 110-c may generate and drive an AC signalonto pin 220-c based on determining that a supply voltage is outside atarget range, for example. In some cases, if memory device 110-cdetermines that the supply voltage is within the target range, memorydevice 110-c may not generate an AC signal, or may generate an AC signal(e.g., a different AC signal) indicating that the supply voltage iswithin the target range. Thus, memory device 110-c may generate an ACsignal at pin 220-c some or all of the time.

A voltage signal at pin 220-c may therefore be a combination of a DCvoltage signal (e.g., provided by voltage source 325-c) and, at times,an AC voltage signal (e.g., generated by driver 405). The AC componentof the signal at pin 220-c may be communicated to power managementcomponent 205-b using a capacitive component 265-c that is coupled withpin 220-c and may pass (e.g., communicate, transmit) the AC voltagesignal and block the DC voltage signal. That is, the capacitivecomponent 265-c, possibly along with resistance within the circuitry,may function as a high-pass filter that allows the AC voltage signal tobe transmitted while filtering out the DC voltage signal. Thus, thepower management component 205-b may receive the AC voltage signal butnot the DC voltage signal. Power management component 205-b may, aspreviously described, maintain or adjust a supply voltage based on thereceived AC voltage signal.

FIG. 5 shows a block diagram 500 of a memory device 505 that supportsfeedback for power management of a memory die using capacitive couplingin accordance with examples as disclosed herein. The memory device 505may be an example of aspects of a memory device as described withreference to FIGS. 1 through 4. The memory device 505 may include anidentification component 510, a determination component 515, and an ACsignal generation component 520. Each of these modules may communicate,directly or indirectly, with one another (e.g., via one or more buses).

The identification component 510 may identify, at a memory device basedat least in part on a direct current (DC) voltage at a pin of the memorydevice, a configuration setting of the memory device. In some examples,the configuration setting indicates a configuration of a command addressmode of the memory device or a configuration of a test mode of thememory device.

In some examples, the determination component 515 may determine, afteridentifying the configuration setting, that a supply voltage for thememory device is outside a target range associated with the supplyvoltage. In some examples, the determination component 515 may determinea value of the supply voltage. In some examples, the determinationcomponent 515 may determine that the supply voltage is below a lowervoltage threshold of the target range or above a higher voltagethreshold of the target range.

The AC signal generation component 520 may generate an AC signal at thepin of the memory device based on determining that the supply voltage isoutside the target range. In some examples, the AC signal generationcomponent 520 may generate an AC signal by generating a quantity ofvoltage pulses based on the value of the supply voltage or based ondetermining that the supply voltage is below a lower voltage thresholdof the target range. In some examples, the quantity of voltage pulsesindicates the value of the supply voltage.

The memory access component 525 may perform a first access operationbased at least in part on the configuration setting of the memorydevice. In some examples, the first access operation is a readoperation, a write operation, or a test operation.

FIG. 6 shows a flowchart illustrating a method or methods 600 thatsupports feedback for power management of a memory die using capacitivecoupling in accordance with examples as disclosed herein. The operationsof method 600 may be implemented by a memory device or its components asdescribed with reference to FIGS. 1-4. In some examples, the operationsof method 600 may be performed by a memory device as described withreference to FIG. 5. In some examples, a memory device may execute a setof instructions to control the functional elements of the memory deviceto perform the described functions. Additionally or alternatively, amemory device may perform aspects of the described functions usingspecial-purpose hardware.

At 605, the memory device may identify, based at least in part on a DCvoltage at a pin of the memory device, a configuration setting of thememory device. The operations of 605 may be performed according to themethods described with reference to FIGS. 2-4. In some examples, aspectsof the operations of 605 may be performed by an identification componentas described with reference to FIG. 5.

At 610, the memory device may determine, after identifying theconfiguration setting, that a supply voltage for the memory device isoutside a target range associated with the supply voltage. Theoperations of 610 may be performed according to the methods describedwith reference to FIGS. 2-4. In some examples, aspects of the operationsof 610 may be performed by a determination component as described withreference to FIG. 5.

At 615, the memory device may generate an AC signal at the pin based atleast in part on determining that the supply voltage is outside thetarget range. The operations of 615 may be performed according to themethods described with reference to FIGS. 2-4. In some examples, aspectsof the operations of 615 may be performed by an AC signal generationcomponent as described with reference to FIG. 5.

In some examples, an apparatus as described herein may perform a methodor methods, such as the method 600. The apparatus may include features,means, or instructions (e.g., a non-transitory computer-readable mediumstoring instructions executable by a processor) for identifying, at amemory device based at least in part on a DC voltage at a pin of thememory device, a configuration setting of the memory device.

Some examples of the method 600 and the apparatus described herein mayfurther include operations, features, means, or instructions fordetermining, after identifying the configuration setting, that a supplyvoltage for the memory device is outside a target range associated withthe supply voltage. Some examples of the method 600 and the apparatusdescribed herein may further include operations, features, means, orinstructions for generating an alternating current (AC) signal at thepin of the memory device based at least in part on determining that thesupply voltage is outside the target range.

FIG. 7 shows a flowchart illustrating a method or methods 700 thatsupports feedback for power management of a memory die using capacitivecoupling in accordance with examples as disclosed herein. In someexamples, the operations of method 700 may be implemented by a memorydevice or its components as described with reference to FIGS. 1-4. Insome examples, the operations of method 700 may be performed by a memorydevice as described with reference to FIG. 5. In some examples, a memorydevice may execute a set of instructions to control the functionalelements of the memory device to perform the described functions.Additionally or alternatively, a memory device may perform aspects ofthe described functions using special-purpose hardware.

At 705, the memory device may identify, based at least in part on a DCvoltage at a pin of the memory device, a configuration setting of thememory device. The operations of 705 may be performed according to themethods described with reference to FIGS. 2-4. In some examples, aspectsof the operations of 705 may be performed by an identification componentas described with reference to FIG. 5.

At 710, the memory device may perform a first access operation based atleast in part on the configuration setting of the memory device. Theoperations of 710 may be performed according to the methods describedwith reference to FIGS. 2-4. In some examples, aspects of the operationsof 710 may be performed by a memory access component as described withreference to FIG. 5.

At 715, the memory device may determine that a supply voltage for thememory device is outside a target range associated with the supplyvoltage. The operations of 715 may be performed according to the methodsdescribed with reference to FIGS. 2-4. In some examples, aspects of theoperations of 715 may be performed by a determination component asdescribed with reference to FIG. 5.

At 720, the memory device may generate an AC signal at the pin of thememory device based at least in part on determining that the supplyvoltage is outside the target range. The operations of 720 may beperformed according to the methods described with reference to FIGS.2-4. In some examples, aspects of the operations of 720 may be performedby an AC signal generation component as described with reference to FIG.5.

In some examples, an apparatus as described herein may perform a methodor methods, such as the method 700. The apparatus may include features,means, or instructions (e.g., a non-transitory computer-readable mediumstoring instructions executable by a processor) for identifying, basedat least in part on a DC voltage at a pin of a memory device, aconfiguration setting of the memory device.

Some examples of the method 700 and the apparatus described herein mayfurther include operations, features, means, or instructions forperforming a first access operation based at least in part on theconfiguration setting of the memory device. Some examples of the method700 and the apparatus described herein may further include operations,features, means, or instructions for determining, after identifying theconfiguration setting, that a supply voltage is outside a target rangeassociated with the supply voltage. Some examples of the method 700 andthe apparatus described herein may further include operations, features,means, or instructions for generating an AC signal at the pin of thememory device based at least in part on determining that the supplyvoltage is outside the target range.

It should be noted that the methods described above describe possibleimplementations, and that the operations and the steps may be rearrangedor otherwise modified and that other implementations are possible.Furthermore, portions from two or more of the methods may be combined.

An apparatus is described. The apparatus may include an array of memorycells, a pin for communicating a DC voltage that indicates an operatingconfiguration setting of the apparatus, a capacitive component coupledwith the pin and for communicating an AC signal at the pin, and acontroller operable to cause the apparatus to determine that a supplyvoltage for the array of memory cells is outside a target rangeassociated with the supply voltage and generate the AC signal at the pinbased on determining that the supply voltage is outside the targetrange.

Some examples of the apparatus may include a driver coupled with the pinand the controller and operable to generate the AC signal by generatinga quantity of voltage pulses at the pin based on a signal received fromthe controller. Some examples may further include determining a value ofthe supply voltage, where the quantity of voltage pulses may be based onthe value of the supply voltage. Some examples of the apparatus mayinclude a voltage source coupled with the pin and configured to generatethe DC voltage.

Some examples may further include determining the operatingconfiguration of the apparatus based on the DC voltage at the pin, wherethe operating configuration indicates a configuration of a commandaddress mode of the apparatus or a configuration of a test mode of theapparatus. Some examples may further include performing, beforedetermining that the supply voltage may be outside the target range, anaccess operation on the array of memory cells based on the operatingconfiguration.

Some examples may further include performing, before determining thatthe supply voltage may be outside the target range, a test operation onthe array of memory cells based on the operating configuration. Someexamples may further include determining, at a first time, that thesupply voltage may be below a lower voltage threshold of the targetrange, where determining that the supply voltage may be outside of thetarget range may be based on determining that the supply voltage may bebelow the lower voltage threshold, and generate a first AC signal basedon determining that the supply voltage may be below the lower voltagethreshold, where generating the AC signal includes generating the firstAC signal.

Some examples may further include determining, at a second timedifferent than the first time, that the supply voltage may be above anupper voltage threshold of the target range, and generate a second ACsignal based on determining that the supply voltage may be above theupper voltage threshold. In some examples, the capacitive componentincludes a discrete capacitor.

An apparatus is described. The apparatus may include an array of memorycells, a pin for providing output of loopback information based on aloopback setting of the apparatus, a capacitive component coupled withthe pin for communicating AC signal at the pin, a controller operable tocause the apparatus to, set the pin to an inactive state based ondetermining that the apparatus is operating in the mode different thanthe loopback mode, determine, after setting the pin to the inactivestate, that a supply voltage for the array of memory cells is outside atarget range associated with the supply voltage, and generate the ACsignal at the pin based on determining that the supply voltage isoutside the target range.

In some examples, setting the pin to the inactive state may includeoperations, features, means, or instructions for setting the pin to ahigh impedance state or terminating the pin. Some examples may furtherinclude determining that the loopback setting indicates that theapparatus may be operating in the loopback mode, and provide the outputbased on determining that the loopback setting indicates that theapparatus may be operating in the loopback mode. In some examples,generating the AC signal may include operations, features, means, orinstructions for generating a quantity of voltage pulses at the pin.

Information and signals described herein may be represented using any ofa variety of different technologies and techniques. For example, data,instructions, commands, information, signals, bits, symbols, and chipsthat may be referenced throughout the above description may berepresented by voltages, currents, electromagnetic waves, magneticfields or particles, optical fields or particles, or any combinationthereof. Some drawings may illustrate signals as a single signal;however, it will be understood by a person of ordinary skill in the artthat the signal may represent a bus of signals, where the bus may have avariety of bit widths.

The terms “electronic communication,” “conductive contact,” “connected,”and “coupled” may refer to a relationship between components thatsupports the flow of signals between the components. Components areconsidered in electronic communication with (or in conductive contactwith or connected with or coupled with) one another if there is anyconductive path between the components that can, at any time, supportthe flow of signals between the components. At any given time, theconductive path between components that are in electronic communicationwith each other (or in conductive contact with or connected with orcoupled with) may be an open circuit or a closed circuit based on theoperation of the device that includes the connected components. Theconductive path between connected components may be a direct conductivepath between the components or the conductive path between connectedcomponents may be an indirect conductive path that may includeintermediate components, such as switches, transistors, or othercomponents. In some examples, the flow of signals between the connectedcomponents may be interrupted for a time, for example, using one or moreintermediate components such as switches or transistors.

The term “coupling” refers to condition of moving from an open-circuitrelationship between components in which signals are not presentlycapable of being communicated between the components over a conductivepath to a closed-circuit relationship between components in whichsignals are capable of being communicated between components over theconductive path. When a component, such as a controller, couples othercomponents together, the component initiates a change that allowssignals to flow between the other components over a conductive path thatpreviously did not permit signals to flow.

The term “isolated” refers to a relationship between components in whichsignals are not presently capable of flowing between the components.Components are isolated from each other if there is an open circuitbetween them. For example, two components separated by a switch that ispositioned between the components are isolated from each other when theswitch is open. When a controller isolates two components, thecontroller affects a change that prevents signals from flowing betweenthe components using a conductive path that previously permitted signalsto flow.

The devices discussed herein, including a memory array, may be formed ona semiconductor substrate, such as silicon, germanium, silicon-germaniumalloy, gallium arsenide, gallium nitride, etc. In some examples, thesubstrate is a semiconductor wafer. In other examples, the substrate maybe a silicon-on-insulator (SOI) substrate, such as silicon-on-glass(SOG) or silicon-on-sapphire (SOP), or epitaxial layers of semiconductormaterials on another substrate. The conductivity of the substrate, orsub-regions of the substrate, may be controlled through doping usingvarious chemical species including, but not limited to, phosphorous,boron, or arsenic. Doping may be performed during the initial formationor growth of the substrate, by ion-implantation, or by any other dopingmeans.

A switching component or a transistor discussed herein may represent afield-effect transistor (FET) and comprise a three terminal deviceincluding a source, drain, and gate. The terminals may be connected toother electronic elements through conductive materials, e.g., metals.The source and drain may be conductive and may comprise a heavily-doped,e.g., degenerate, semiconductor region. The source and drain may beseparated by a lightly-doped semiconductor region or channel. If thechannel is n-type (i.e., majority carriers are signals), then the FETmay be referred to as a n-type FET. If the channel is p-type (i.e.,majority carriers are holes), then the FET may be referred to as ap-type FET. The channel may be capped by an insulating gate oxide. Thechannel conductivity may be controlled by applying a voltage to thegate. For example, applying a positive voltage or negative voltage to ann-type FET or a p-type FET, respectively, may result in the channelbecoming conductive. A transistor may be “on” or “activated” when avoltage greater than or equal to the transistor's threshold voltage isapplied to the transistor gate. The transistor may be “off” or“deactivated” when a voltage less than the transistor's thresholdvoltage is applied to the transistor gate.

The description set forth herein, in connection with the appendeddrawings, describes example configurations and does not represent allthe examples that may be implemented or that are within the scope of theclaims. The term “exemplary” used herein means “serving as an example,instance, or illustration,” and not “preferred” or “advantageous overother examples.” The detailed description includes specific details toproviding an understanding of the described techniques. Thesetechniques, however, may be practiced without these specific details. Insome instances, well-known structures and devices are shown in blockdiagram form to avoid obscuring the concepts of the described examples.

In the appended figures, similar components or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If just the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

Information and signals described herein may be represented using any ofa variety of different technologies and techniques. For example, data,instructions, commands, information, signals, bits, symbols, and chipsthat may be referenced throughout the above description may berepresented by voltages, currents, electromagnetic waves, magneticfields or particles, optical fields or particles, or any combinationthereof.

The various illustrative blocks and modules described in connection withthe disclosure herein may be implemented or performed with ageneral-purpose processor, a DSP, an ASIC, an FPGA or other programmablelogic device, discrete gate or transistor logic, discrete hardwarecomponents, or any combination thereof designed to perform the functionsdescribed herein. A general-purpose processor may be a microprocessor,but in the alternative, the processor may be any processor, controller,microcontroller, or state machine. A processor may also be implementedas a combination of computing devices (e.g., a combination of a DSP anda microprocessor, multiple microprocessors, one or more microprocessorsin conjunction with a DSP core, or any other such configuration).

The functions described herein may be implemented in hardware, softwareexecuted by a processor, firmware, or any combination thereof. Ifimplemented in software executed by a processor, the functions may bestored on or transmitted over as one or more instructions or code on acomputer-readable medium. Other examples and implementations are withinthe scope of the disclosure and appended claims. For example, due to thenature of software, functions described above can be implemented usingsoftware executed by a processor, hardware, firmware, hardwiring, orcombinations of any of these. Features implementing functions may alsobe physically located at various positions, including being distributedsuch that portions of functions are implemented at different physicallocations. Also, as used herein, including in the claims, “or” as usedin a list of items (for example, a list of items prefaced by a phrasesuch as “at least one of” or “one or more of”) indicates an inclusivelist such that, for example, a list of at least one of A, B, or C meansA or B or C or AB or AC or BC or ABC (i.e., A and B and C). Also, asused herein, the phrase “based on” shall not be construed as a referenceto a closed set of conditions. For example, an exemplary step that isdescribed as “based on condition A” may be based on both a condition Aand a condition B without departing from the scope of the presentdisclosure. In other words, as used herein, the phrase “based on” shallbe construed in the same manner as the phrase “based at least in parton.”

The description herein is provided to enable a person skilled in the artto make or use the disclosure. Various modifications to the disclosurewill be apparent to those skilled in the art, and the generic principlesdefined herein may be applied to other variations without departing fromthe scope of the disclosure. Thus, the disclosure is not limited to theexamples and designs described herein, but is to be accorded thebroadest scope consistent with the principles and novel featuresdisclosed herein.

What is claimed is:
 1. A system, comprising: a power managementcomponent operable to provide a supply voltage to a plurality of memorydevices; a first memory device of the plurality comprising a first pincoupled with a first direct current (DC) voltage that indicates a firstconfiguration setting of the first memory device; a second memory deviceof the plurality comprising a second pin coupled with a second DCvoltage that indicates a second configuration setting of the secondmemory device; a first capacitive component positioned along a firstsignal path between the first pin and the power management componentthat is for communicating a first alternating current (AC) signal at thefirst pin to the power management component, wherein the first memorydevice is operable to determine that the supply voltage is outside atarget range and generate the first AC signal at the first pin based atleast in part on determining that the supply voltage is outside thetarget range; and a second capacitive component positioned along asecond signal path between the second pin and the power managementcomponent that is for communicating a second AC signal at the second pinto the power management component, wherein the second memory device isoperable to determine that the supply voltage is outside the targetrange and to generate the second AC signal at the second pin based atleast in part on determining that the supply voltage is outside thetarget range.
 2. The system of claim 1, wherein the power managementcomponent is configured to: receive the first AC signal via the firstcapacitive component; receive the second AC signal via the secondcapacitive component; and adjust the supply voltage based at least inpart on the first AC signal, the second AC signal, or both.
 3. Thesystem of claim 1, further comprising a first voltage source coupledwith the first pin and configured to generate the first DC voltage. 4.The system of claim 1, further comprising a second voltage sourcecoupled with the second pin and configured to generate the second DCvoltage.
 5. The system of claim 1, wherein: the first memory devicecomprises a first driver configured to generate the first AC signal atthe first pin by generating a first quantity of voltage pulses at thefirst pin based at least in part on the first memory device determiningthat the supply voltage is outside the target range; and the secondmemory device comprises a second driver configured to generate thesecond AC signal at the second pin by generating a second quantity ofvoltage pulses at the second pin based at least in part on the secondmemory device determining that the supply voltage is outside the targetrange.
 6. A system, comprising: a power management component operable toprovide a supply voltage to a plurality of memory device; a memorydevice comprising a pin coupled with a direct current (DC) voltage thatindicates a configuration setting of the memory device; and a secondmemory device comprising a second pin coupled with a second DC voltagethat indicates a second configuration setting of the second memorydevice; a capacitive component positioned along a signal path betweenthe pin and the power management component that is for communicating analternating current (AC) signal at the pin to the power managementcomponent; and a second capacitive component positioned along a secondsignal path between the second pin and the power management componentthat is for communicating a second AC signal at the second pin to thepower management component.
 7. The system of claim 6, wherein the memorydevice is operable to determine that the supply voltage is outside atarget range.
 8. The system of claim 7, wherein the memory device isoperable to generate the AC signal at the pin based at least in part ondetermining that the supply voltage is outside the target range.
 9. Thesystem of claim 8, wherein the memory device is operable to generate afirst AC signal based at least in part on determining that the supplyvoltage is below the target range, and operable to generate a second ACsignal based at least in part on determining that the supply voltage isabove the target range, wherein the AC signal comprises the first ACsignal or the second AC signal.
 10. The system of claim 6, wherein theAC signal comprises a quantity of pulses, the quantity of pulses basedat least in part on the supply voltage.
 11. The system of claim 10,wherein the memory device is configured to determine a value of thesupply voltage, wherein the quantity of pulses is based at least in parton the value.
 12. The system of claim 6, wherein the power managementcomponent is operable to adjust the supply voltage based at least inpart on receiving the AC signal.
 13. The system of claim 6, wherein thesecond memory device is operable to determine that the supply voltage isoutside a target range and to generate the second AC signal at thesecond pin based at least in part on determining that the supply voltageis outside the target range.
 14. A system, comprising: a powermanagement component operable to provide a supply voltage to a pluralityof memory devices; a memory device operable to receive the supplyvoltage and comprising a pin coupled with a direct current (DC) voltage,the memory device configured to identify, based at least in part on theDC voltage, a configuration setting of the memory device; a secondmemory device operable to receive the supply voltage and comprising asecond pin coupled with a second DC voltage, the second memory deviceconfigured to identify, based at least in part on the second DC voltage,a configuration setting of the second memory device; a capacitivecomponent positioned along a signal path between the pin and the powermanagement component, the capacitive component configured to communicatean alternating current (AC) signal at the pin to the power managementcomponent; and a second capacitive component positioned along a secondsignal path between the second pin and the power management component,the second capacitive component configured to communicate a second ACsignal at the second pin to the power management component.
 15. Thesystem of claim 14, wherein the memory device is operable to determinethat the supply voltage is outside a target range.
 16. The system ofclaim 15, wherein the memory device is operable to generate the ACsignal at the pin based at least in part on determining that the supplyvoltage is outside the target range.
 17. The system of claim 15, whereinthe memory device is further configured to perform, before determiningthat the supply voltage is outside the target range, a first accessoperation based at least in part on the configuration setting.
 18. Thesystem of claim 16, wherein the memory device is operable to generate afirst AC signal based at least in part on determining that the supplyvoltage is below the target range, and operable to generate a second ACsignal based at least in part on determining that the supply voltage isabove the target range, wherein the AC signal comprises the first ACsignal or the second AC signal.
 19. The system of claim 14, wherein theAC signal comprises a quantity of pulses, the quantity of pulses basedat least in part on the supply voltage.
 20. The system of claim 14,wherein the power management component is operable to adjust the supplyvoltage based at least in part on receiving the AC signal.